Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Manufacturer will introduce SA1.5 COB rental display, CL V3 Micro LED flagship, and AW Pro outdoor solution at official ...
Daktronics has released its Flip-Chip COB (Chip On Board) LED display technology. The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings ranging from ...
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