Business Wire

OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Hyper3D’s Advanced 3D Model Generator Addresses Critical Production Challenges for Professional Creators

The production of high-quality three-dimensional assets has long been constrained by the technical expertise and time investment required to create professional-grade models. Hyper3D, the flagship ...
Morningstar

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...
Silicon Semiconductor

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures

Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization ...
Semiconductor Engineering

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)

A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université ...
EDN

Making your architecture ready for 3D IC

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
Semiconductor Engineering

3D Heterogeneous Integration System To Accelerate LLMs (Georgia Tech)

A new technical paper titled “A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers at Georgia Institute of Technology. ...

Imec pushes 3D HBM-on-GPU technology to extreme limits

D HBM-on-GPU design reaches record compute density for demanding AI workloadsPeak GPU temperatures exceeded 140°C without thermal mitigation strategiesHalving the GPU clock rate reduced temperatures ...
Nasdaq

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...